After we heard reports suggesting that Xiaomi will unveil the Redmi Pro on July 27, the CEO has now given some insights about the upcoming smartphone.
Xiaomi CEO Lei Jun took to social media to reveal that the upcoming Xiaomi Redmi Pro would be powered by the deca-core MediaTek Helio X25 chipset, which till now was exclusive to the Meizu Pro 6. He also mentioned that the handset would be the flagship offering in the Redmi series and as such could be slightly higher priced compared to other Redmi smartphones.
As mentioned in earlier rumours, the Xiaomi Redmi Pro would flaunt an OLED display with a brushed metal back plate. Another major feature of the smartphone is the dual camera setup with the 12 MP Sony IMX260 sensors. We are eagerly awaiting the announcement to know in detail about the high-end Redmi smartphone.
