Moto X (2016) would have modular backplate expansion system; Two variants expected to launch on June 9

In a just a few hours after the press renders of the alleged Moto X (2016) surfaced, detailed information about the handset has now been revealed.


According to reliable the sources, the Moto X (2016) would be just more than a flagship offering. Remember the pins we pointed out on the back panel in yesterdays leak? Well, turns out that they are connectors for Motorola’s new modular backplate hardware expansion system which can host detachable modules called ‘Amps’.

While LG started with the modular smartphone revolution, Motorola seems to be planning to take it quite ahead. The company is said to be ready with Amps for stereo speakers, extra battery life, a pico projector, camera grip (with optical zoom, no less), and rugged case (with its own wide-angle camera enhancement) all of which would be available at the time of launch.

Now coming to the phones, the Moto X (2016) would apparently have two variants. While their launch names are not yet known, they are currently being developed under the codenames of Vector Thin and Vertex.

The Vector Thin would be the premium flagship offering with a 5.5 inch Quad HD display and powered by the Qualcomm Snapdragon 820 processor along with 3 GB or 4 GB RAM options. The Vertex on the other hand would have the specs toned down a bit with the same 5.5 inch display but with full HD resolution and a Qualcomm Snapdragon 625 processor with 2 GB or 3 GB RAM options.


Finally, coming to the launch date, Lenovo seems to have made it pretty crystal clear by announcing the Lenovo Tech World 2016 on June 9. Alongside the flagship Moto X (2016) smartphones, the company is also set to showcase its first consumer-ready Project Tango smartphone. Seems like Lenovo has a lot of interesting stuff to show this time.